400G OSFP-RHS LR4 10Km EML Transceiver Module

400G OSFP-RHS LR4 10Km EML Transceiver Module

Applications

 

  • 400G-LR4 Technical Spec D2p0
  • CEI-112G-VSR-PAM4
  • OSFP MSA
  • Data center network
  • Product Detail

400G OSFP-RHS LR4 10Km EML Transceiver Module

ROSP-RHS-400G-LR4C

 

Description

 

This FIBERWDM ROSP-RHS-400G-LR4C product is designed for 10km optical communication applications. The module converts 4 channels of 100Gb/s (PAM4) electrical input data to 4 channels of CWDM optical signals, and multiplexes them into a single channel for 400Gb/s optical transmission. Reversely, on the receiver side, the module optically de-multiplexes a 400Gb/s optical input into 4 channels of CWDM optical signals and converts them to 4 channels of 100Gb/s (PAM4) electrical output data.

The module incorporates 4 independent channels on CWDM4 1271/1291/1311/1331nm center wavelength, operating at 100G per channel. The transmitter path incorporates 4 independent EML drivers and EML lasers together with an optical multiplexer. On the receiver path, an optical de- multiplexer is coupled to a 4-channel photodiode array.

It is a cost-effective and lower power consumption solution for 400GBASE data center. It has been designed to meet the harshest external operating conditions including temperature, humidity and EMI interference. The module offers very high functionality and feature integration, accessible via a two-wire serial interface. 

 

Features

 

  • 4 channels full-duplex transceiver modules
  • Transmission data rate up to 106.25G per channel
  • 4x106.25Gbps PAM4 transmitter and PAM4 receiver
  • Hot Pluggable OSFP-RHS form factor and Compliant with CMIS
  • Compliant to 400G-LR4 Technical Specification                                                                           
  • Power consumption <10W
  • Maximum link length of 10Km G.652 SMF with KP-FEC
  • Built-in digital diagnostic functions
  • Operating case temperature 0°C to +70°C
  • 3.3V power supply voltage
  • RoHS compliant(lead free)

 

 

Figure1. Module Block Diagram

Absolute Maximum Ratings

 

Parameter Symbol Min Max Unit
Supply Voltage Vcc -0.3 3.6 V
Input Voltage  Vin -0.3 Vcc+0.3 V
Storage Temperature Tst -40 85 ºC
Case Operating Temperature Top 0 70 ºC
Humidity(non-condensing) Rh 5 95 %

 

Recommended Operating Conditions

 

Parameter Symbol Min Typical Max Unit
Supply Voltage Vcc 3.13 3.3 3.47 V
Operating Case temperature Tca 0   70 ºC
Data Rate Per Lane fd   106.25   Gbit/s
Humidity Rh 15   85 %
Power Dissipation Pm     10 W

 

Electrical Specifications

 

Parameter Symbol Min Typical Max Unit
Differential input impedance  Zin 90 100 110 ohm
Differential Output impedance Zout 90 100 110 ohm
Differential input voltage amplitude ΔVin 900     mVp-p
Differential output voltage amplitude ΔVout     900 mVp-p
Bit Error Rate BER     2.4E-4  
Near-end ESMW (Eye symmetry mask width)   0.265     UI
Near-end Eye height, differential (min)   70     mV
Far-end ESMW (Eye symmetry mask width)   0.20     UI
Far-end Eye height, differential (min)   30     mV
Far-end pre-cursor ISI ratio   -4.5   2.5 %

Note:

1) BER=2.4E-4; PRBS31Q@53.125GBd. Pre-FEC

2) Differential input voltage amplitude is measured between TxnP and TxnN.

3) Differential output voltage amplitude is measured between RxnP and RxnN.

 

Optical Characteristics 

 

Table 3 - Optical Characteristics

 

Parameter Symbol Min Typical Max Unit Notes
Transmitter
Centre Wavelength λ0 1264.5 1271 1277.5 nm  
λ1 1284.5 1291 1297.5 nm  
λ2 1304.5 1311 1317.5 nm  
λ3 1324.5 1331 1337.5 nm  
Side-mode suppression ratio SMSR 30     dB  
Average launch power, each lane Pout -2.7   5.1 dBm  
Optical Modulation Amplitude(OMA outer), each lane OMA 0.3   4.4 dBm  
Transmitter and dispersion eye closure for PAM4 (TDECQ),each lane TDECQ     3.9 dB  
Extinction Ratio ER 3.5     dB  
Average launch power of OFF transmitter, each lane       -16 dB  
Receiver
Centre Wavelength λ0 1264.5 1271 1277.5 nm  
λ1 1284.5 1291 1297.5 nm  
λ2 1304.5 1311 1317.5 nm  
λ3 1324.5 1331 1337.5 nm  
Receiver Sensitivity in  OMA outer RXsen     -6.8 dBm 1

Average power at receiver , each lane

input, each lane
Pin -9   5.1 dBm  
Receiver Reflectance       -26 dB  
LOS Assert   -12     dBm  
LOS De-Assert        -10 dBm  
LOS Hysteresis   0.5     dB  

Note:

1) Measured with conformance test signal at TP3 for BER = 2.4E-4 Pre-FEC

 

Pin Description

 

Note:

1): GND is the symbol for signal and supply (power) common for the OSFP-RHS module. All are common within the OSFP-RHS module and all voltages are referenced to this potential unless otherwise noted. Connect these directly to the host board signal-common ground plane.

2): VCC are the OSFP-RHS power supplies and shall be applied concurrently. The connector pins are each rated for a maximum current of 1.5A (max. current of 2.0 A is required for high module power of 15-20W).

3): Not connected in OSFP-RHS.

 

 

Figure2. OSFP-RHS Module contact assignment

 

INT/RSTn Pin

 

INT/RSTn is a dual function signal that allows the module to raise an interrupt to the host,and also allows the host to reset the module. The circuit shown in Figure 3 enables multi-level signaling to provide direct signal control in both directions. Reset is an active-low signal on the host which is translated to an active-low signal on the module.  Interrupt is an active-high signal on the module which gets translated to an active-high signal on the host.The INT/RSTn signal operates in 3 voltage zones to indicate the state of Reset for the module and Interrupt for the host. 

 

Figure 3. INT/RSTn voltage zones

 

LPWn/PRSn Pin

 

LPWn/PRSn is a dual function signal that allows the host to signal Low Power mode and the module to indicate Module Present. The circuit shown in Figure 4 enables multi-level signaling to provide direct signal control in both directions. Low Power mode is an active-low signal on the host which gets converted to an active-low signal on the module. Module Present is controlled by a pull-down resistor on the module which gets converted to an active-low logic signal on the host.

 

Figure 4. LPWn/PRSn voltage zones

 

OSFP Host Board and Module Block Diagram

 

Figure 5 is an example block diagram of the host board’s connections to the OSFP module. 

 

Figure5. Host board and Module block diagram

 

DIAGNOSTIC MONITORING INTERFACE

 

Digital diagnostics monitoring function is available on all FIBERWDM OSFP-RHS products. A 2-wire serial interface provides user to contact with module.

 

Memory Structure and Mapping

 

This limits the management memory that can be directly accessed by the host to 256 bytes, which is divided in Lower Memory (addresses 00h through 7Fh) and Upper Memory (addresses 80h through FFh).

A larger addressable management memory is required for all but the most basic modules. This is supported by a structure of 128-byte pages, together with a mechanism for dynamically mapping any of the 128-byte pages from a larger internal management memory space into Upper Memory the host addressable space.

The addressing structure of the additional internal management memory2 is shown in Figure 4 The management memory inside the module is arranged as a unique and always host accessible address space of 128 bytes (Lower Memory) and as multiple upper address subspaces of 128 bytes each (Pages), only one of which is selected as host visible in Upper Memory. A second level of Page selection is possible for Pages for which several instances exist (e.g. where a bank of pages with the same Page number exists).

This structure supports a flat 256 byte memory for passive copper modules and permits timely access to addresses in the Lower Memory, e.g. Flags and Monitors. Less time critical entries, e.g. serial ID information and threshold settings, are available with the Page Select function in the Lower Page. For more complex modules which require a larger amount of management memory the host needs to use dynamic mapping of the various Pages into the host addressable Upper Memory address space, whenever needed.

Note: The management memory map has been designed largely after the QSFP memory map. This memory map has been changed in order to accommodate 8 electrical lanes and to limit the required memory space. The single address approach is used as found in QSFP. Paging is used in order to enable time critical interactions between host and module.

 

Supported Pages

 

A basic 256 byte subset of the Management Memory Map is mandatory for all CMIS compliant devices. Other parts are only available for paged memory modules, or when advertised by the module. See CMIS V4.0 for details regarding the advertisement of supported management memory spaces.

In particular, support of the Lower Memory and of Page 00h is required for all modules, including passive copper cables. These pages are therefore always implemented. Additional support for Pages 01h, 02h and bank 0 of Pages 10h and 11h is required for all paged memory modules.

Bank 0 of pages 10h-1Fh, provides lane-specific registers for the first 8 lanes, and each additional bank provides support for additional 8 lanes. Note, however, that the allocation of information over the banks may be page specific and may not to be related to grouping data for 8 lanes.

The structure allows address space expansion for certain types of modules by allocating additional Pages. Moreover, additional banks of pages.

 

Figure4. QSFP112 Memory Map

 

Mechanical Dimensions

 

Figure5. Mechanical Specifications

 

Regulatory Compliance

 

FIBERWDM ROSP-RHS-400G-LR4C transceivers are Class 1 Laser Products. They meet the requirements of the following standards:

 

Feature Standard
Laser Safety

IEC 60825-1:2014 (3rd Edition)

IEC 60825-2:2004/AMD2:2010

EN 60825-1-2014

EN 60825-2:2004+A1+A2
Electrical Safety

EN 62368-1: 2014

IEC 62368-1:2014

UL 62368-1:2014
Environmental protection  Directive 2011/65/EU with amendment(EU)2015/863
CE EMC EN55032:2015
EN55035:2017
EN61000-3-2:2014
EN61000-3-3:2013
FCC

FCC Part 15, Subpart B

ANSI C63.4-2014

 

References

 

1. OSFP MSA

2. CMIS 4.0

3. 400G-LR4 Technical Specification 

4. IEEE802.3ck

5. OIF CEI-112G-VSR-PAM4

 

CAUTION: 

 

Use of controls or adjustment or performance of procedures other than those specified herein may result in hazardous radiation exposure.

 

Ordering information

 

Part Number Product Description
ROSP-RHS-400G-LR4C OSFP-RHS, 400GBASE-LR4, 10Km on Single mode Fiber (SMF),with DSP Power consumption <10W, duplex LC connector.

 

Important Notice

 

Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by FIBERWDM before they become applicable to any particular order or contract. In accordance with the FIBERWDM policy of continuous improvement specifications may change without notice.

The publication of information in this data sheet does not imply freedom from patent or other protective rights of FIBERWDM or others. Further details are available from any FIBERWDM sales representative.

 

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